Additive Process Technologies are a process development and contract engineering company delivering solutions for the flexible electronic circuit sector:


Company Solutions
The 'Ready to go' solutions overviewed here have been developed from our range of patented technologies. These solutions could be adapted, or new solutions can be created, to meet your specific application needs.

 

 

 



Our solutions are based on:


Skills and Expertise
  • Conductive and polymer ink printing
        with particular focus on screen printing
  • Selective electroplating
  • Precise positioning
Patents
  • Electroplating - 3 main patents which are all granted in the
     USA and certain other countries and in the process of world      wide approval. The patents are all ‘conceptual' and can be      summarised as follows:
» 'Non-bath' plating. This is the fundamental enabling patent as it
   protects the presentation of the substrate to the plating bath
   which is the operating basis of the FFD system.
» ‘Finger' construction of the cathode.
» Segmented anode construction, current control and electrolyte
   flow.
  • Precise positioning.  2 main patents which again are      conceptual and summarised as follows:            
» Moving camera for registration to unseen substrate
» Chip placement – specifically to compensate for speed loss
   in chip placement by using a high speed jig loading stage