APT’s innovative technologies are the platform for applications spanning a broad spectrum of sectors.
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RFID, NFC or simliar: Key enabler of low cost RFID/Near Field Communication tags. World’s only fully integrated tag manufacturing process producing copper antennae direct-to-pads of ICs or printed electronic devices (IC agnostic) without conductive adhesives on many substrates; even on paper. Using printed semiconductors, roadmap to ultra low cost RFID/NFC to realize ubiquitous item-level tagging for Internet of Things and direct to the consumer contact at point-of-purchase and post sale.
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For private, public and military sectors, lower cost for all goods transported from raw materials through consumption. Less weight and lower maintenance costs → lower logistical/operational costs throughout supply chain, and for consumer = economy growth.
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Wiring harness replacements for Land, Sea, Air, Space, Robotics: Trouble free, reduced complexity; lighter vehicles use less energy, lower fuel costs, perform better, reduce oil dependence.
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Specialised large complex as well as high volume small planar structures; e.g., display electrode connections; RADAR applications; stealthy objects and frequency selective patterning; circuits produced in real time for connection to objects/sensors.
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Solar: Cost + weight reduction for cell/panel conductors — Electrodeposited Cu for (1) Gridlines: 20-30µm wide; (2) Backplane: sculptured/graduated thickness.
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Aerospace, Automotive, Marine/Submarine, General: Circuited and wireless connectivity of networked sensor arrays/strain gauges for system health monitoring, robots, medical prostheses; wireless sensors for energy harvesting; substitution of traditional costly, heavy wiring harnesses to backplanes; ultra large backplanes; telematics; jet engine flex circuits; rotor and fixed wing anti-icing/de-icing; lightning strike protection; satellite and UAV weight reduction.
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Direct Write examples in the military/aerospace sector are ultra-lightweight copper conductors directly onto materiel subject to high accelerative forces and/or significant vibrational stresses; e.g., weight reduction in… fast jet pilot helmets, rockets and launchers, intelligent munitions and smart weapons, electrical and electronic connectivity in materiel and all vehicles, secure communications, personnel weight burden reduction for electronics (helmets/clothes)..
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Minimal maintenance and reduced cost sensors integrated onto / into [composite] structures; inherently simpler, more robust.
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Heating and Composites manufacturing: Low cost resistance calibrated panels for controlled heating of ambient spaces and surfaces. Selectively heated tooling to produce large and small composite structures with variable thickness, out-of-autoclave.
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CAD driven robotic post-production modification of existing Printed Circuit Boards in aerospace and other sectors.
Additive Process